qq上海麻将外挂 www.urlxv.tw It’s our target to know the needs of customer, marketing trend, keep on innovative researching, and to become a global company. Our goal is devoting to develop and provide advanced technology to meet even surpass the current and next generation needs of customers. By benchmarking with international technology roadmaps, for kinds of future product needs, applying next generation development of advanced technology asap to create Intellectual Property, leading position, stability of technology. As a result, enhance competitive strength and fulfill our customers. Unimicron also makes great efforts in environmental friendly and low-cost processes. It’s our goal to build our core competence base on technology innovation and intellectual properties.
For PCB SBU R&D technologies are listed below：
Fine line process, Low Dk /Df dielectric material and Copper filled via .In addition, there are also new products in the field of. Our patent counts and technology capability in these areas are all in positions among the world leaders.
- Rigid-Flex PCB
- High Reliability Automobile PCB
- Micro-LED PCB
- Fine pitch Connector PCB
- NB HDI PCB
For IC Carrier SBU R&D technologies are listed below：
- Ultra -fine pitch circuit
- Ultra fine bump pitch uball
- Cu pillar technology
- Coreless technology